Product Overview：
Three-dimensional topography measurement of the product, a collection of phase difference interference, white light interference, confocal, multifocal superposition of the four-in-one technology, can do surface measurement, coplanarity detection, grinding roughness detection, particle size detection, structure measurement, hole depth aperture, roundness, film thickness measurement, RDL line measurement, laser cutting groove detection, line width, line spacing, copper thickness before drying film, SOLDER MASK opening size, copper surface roughness and many other three-dimensional measurement items.
The 3D automatic measuring machine is mainly used for three-dimensional topography measurement of wafers, PCB boards and other products. The equipment can carry out 3D topography measurement of the surface of PCB products with high precision, speed and automation.
Performance metrics：
1).High accuracy (0.1 nm high resolution)
2).Super fast（2S/FOV）
3).Multifunctional (confocal/interfero/multifocus)
4).Multi-point programming measurement
5).Automation (automatic scanning, automatic data statistics, automatic data upload)
6).Barcode reading calls the template
7).CCD Image Positioning (Expansion, Contraction, Placement Offset Correction)
8).SECS/GEM
